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R&D works
Amepox Microelectronics Ltd. R&D staff are highly educated and with many years of experience in field of materials for electronic applications. They are working very closely with Customers and at this way we are very sensitive for their specific requirements.
AXMC has many unique achievements as new types of materials and technology solutions, for example:
  • Electrically conductive formulations with nano silver additive,
  • Electrically conductive ink for Ink-Jet technology,
  • Nano silver with particle size atomic range,
  • New, TAEC technology (thermally activated of electrical conductivity) with very small particle size formulations.etc.
  • Solderable after drying and electrically conductive paint,
  • Extremely flexible electrically conductive ink,
  • Electrically conductive formulations with very high temp. resistance,
  • Copper powder with very high tap density,
  • Silver semiflake with very high tap density,
  • Silver powder with the highest purity and nano size particles,
AXMC materials, technologies and results of researches were presented on well-known international conferences and special exercises for experts from electronic industry.

List of articles and conference lectures is showed below:

  1. Fałat Tomasz, Felba Jan, Płatek Bartosz, Piasecki Tomasz, Mościcki Andrzej, Smolarek Anita.: "Low-temperature, photonic approach to sintering the ink-jet printed conductive microstructures containing nano sized silver particles", EMPC-2011 18th European Microelectronics & Packaging Conference, Brighton, UK, September 12-15, 2011r.
  2. Mościcki Andrzej, Smolarek Anita, Felba Jan, Fałat Tomasz.:"Influence of different type protective layer on silver metallic nanoparticles for Ink-Jet printing technique", EMPC-2011 18th European Microelectronics & Packaging Conference, Brighton, UK, September 12-15, 2011r.
  3. Smolarek Anita., Mościcki Andrzej., Kinart Andrzej., Felba Jan., Fałat Tomasz.: "Dependency of silver nanoparticles protective layers on sintering temperature of printed conductive structures", ISSE 2011, High Tatras, Slovakia. May 11-15, 2011r.
  4. Felba Jan., Bryjak Marek., Mościcki Andrzej.: „Conductive structures printing on flexible substratem”, Flexible electronic systems
         9th international workshop, Germany, Munich, December 02, 2010r.
  5. Andrzej Mościcki., Anita Smolarek.: “Nanoink conductive technology”, The Czech Nanotechnology Cluster, Seminar of Modern Technology Transfers. Czech Republic, Olomouc, November 24, 2010r.
  6. Andrzej Kinart., Andrzej Mościcki., Anita Smolarek.: „Stability of Electrically Conductive Ink”, NANOTECHNOLOGIA-PL, Poland, Warsaw, September 14, 2010r.
  7. Fałat Tomasz., Felba Jan., Mościcki Andrzej., Smolarek Anita., Bock Karlheinz., Bonfert Detlef.:“ Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics”, Eleclronic System - Integration Technology Conference (ESTC ), 2010 3 rd, Germany, Berlin, September 13-16, 2010r.
  8. Andrzej Mościcki., Andrzej Kinart., Jan Felba., Karol Nitsch., Tomasz Piasecki., Sebastian Tesarski., Detlef Bonfert., Karlheinz Bock.: “Properties of Conductive Microstructures Containing Nano Size Silver Particles”, EPTC Conference, Singapore, Dec. 9-11, 2009.
  9. Jan Felba., Karol Nitsch., Tomasz Piasecki., Andrzej Mościcki., Andrzej Kinart.: „The Influence of Thermal Process on Electrical Conductivity Microstructures Made by Ink Containing Nano Sized Silver Particles”, IEEE NANO 2009 Conference, Italy, Genoa, July 26-30, 2009.
  10. Mościcki A., Felba J., Dudziński W.: “Conductive Microstructures and Connections for Microelectronics Made by Ink-Jet Technology”, ESTC 2006 Conference, Dresden, Germany, Sept.5-7,2006.
  11. Kisiel R., Felba J., Borecki J., Mościcki A.: „Stability Properties of PCB Microvias Fillings made by Conductive Adhesives”, 4th European Microelectronics and Packaging Symposium, Terme Catez, Slovenia, May 22-24, 2006.
  12. Mościcki A., Felba J., Sobierajski T., Kudzia J., Arp A., Meyer W.: “Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology”, Polytronic2005, IEEE Int’l Conf. on Polymers & Adhesives Wrocław, Poland, Oct. 23-26, 2005.
  13. Kisiel R., Felba J.,Borecki J., Mościcki A.: „Problems of PCB Microvias Filling by Conductive Paste”, Polytronic 2005, IEEE Int’l Conf. on Polymers & Adhesives, Wrocław, Poland, Oct. 23-26 ,2005.
  14. Kisiel R., Mościcki A., Felba J., Borecki J.: „Technological Aspects of Applaying Conductive Adhesives in Small Diameter Vias” Proc. of XXIX Inter Conf. IMPAS Poland Chapter, Sept. 2005.
  15. Mościcki A., Felba J., Sobierajski T., Kudzia J.: "Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications", Journal of Electronic Packaging, June 2005 p.91-95.
  16. Kisiel R., Borecki J., Felba J., Mościcki A.: „Electrically Conductive Adhesive as Vias Fill in PCB’s: the influence of fill shape and contact matallization on vias resistance stability”, Proc. Of 28th int. Spring Seminar on Electronics Technology, ISSE 2005, p. 193-198.
  17. Felba J., Mościcki A., Bereski M.: „Anisotropic Effect when Using Isotropic Conductive Adhesives”, Polytronic 2004, IEEE Int’l Conf. on Polymers & Adhesives, Portland, USA, Sept. 12-15,2004.
  18. Kisiel R., Borecki J.,Felba J., Mościcki A.: „Technological Aspects of Applaying Conductive Adhesives for Inner Connections in PCB”, Polytronic 2004, IEEE Int’l Conf. on Polymers & Adhesives, Portland, USA, Sept. 12-15,2004.
  19. Mościcki A., Sobierajski T., Fałat T., Felba J.:”The Post-Curing Technology for Conductivity Improvement of Low-Viscosity Electrically Conductive Adhesives”,Micropackaging 2004 Conference, STUniversity, Fuveau, France, Sept.16-17,2004.
  20. Mościcki A., Felba J., Sobierajski T., Kudzia J.: " Snap Curing Electrically Conductive Formulation For Solder Replacement Applications", Polytronic 2003, IEEE Int’l Conf. on Polymers & Adhesives Montreux, Switzerland, Oct. 21-23, 2003.
  21. Kisiel R., Mościcki A.: “Electrically Conductive Adhesives in SMT – the Influence of Adhesive Composition on Mechanical and Electrical Properties”, Proc. of XXIV International Conference IMAPS POLAND 2000, Rytro, September 25-29, 2000, p.199-205.
  22. Felba J.,Friedel K., Kisiel R., Mościcki A.: ”The Influence of Silver filler concentration in Epoxy Adhesives on Electrical and Mechanical Properties of Adhesive Joints”, IMAPS Polańczyk, 2001, September 26-29, p.67-70.
  23. Felba J., Friedel K., Guenthner B., Mościcki A., Schäfer H., “The Influence of Filler Particle Shapes on Adhesive Joints in Microwave Applications”, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Zalaegerszeg, 2002, p. 1-6.
  24. Felba J., Friedel K., Mościcki A.,”Characterization and Performance of Electrically Conductive Adhesives for Microwave Applications”, 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo 2000, s.232-239.
  25. Felba J., Friedel K.P., Kisiel R., Laska W., Mościcki A.,”Solder replacement with electrically conductive adhesives in microwave applications”, European Microelectronics Packaging and Interconnection Symposium, Prague 2000, s.416-421.
  26. Felba J., Kisiel R., Mościcki A., “Mechanical properties of Electrically Conductive Adhesives in PCB Assembly”, 23rd International Spring Seminar on Electronics Technology, Balatonfüred 2000, s.180-184.
  27. Felba J., Friedel K.P., Laska W., Mościcki A., Piotrowski A., “Investigation of the electrically conductive adhesives formulation for high frequency applications”, 23rd Conference of the International Microelectronics and Packaging Society – Poland Chapter, Kołobrzeg 1999, p.119-124.
  28. Felba J., Friedel K.P., Laska W., Mościcki A.,” Electrically conductive adhesives for high frequency applications”, 22nd International Spring Seminar on Electronics Technology, Dresden 1999, s.11-15.
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